Multilayer PCB recieve more than two conductive copper layers which mainly are made up of inner level cores, prepreg tiers and copper foils and they? lso are melted together via heat and stress. Lamination process is among the key to manage good quality of multilayer PCB, this procedure requires specific heating and pressure with regard to specific amounts of time centered on materials accustomed to ensure the PCB board is made properly.

The multilayer PCB is the particular development of the particular double sided PCB with increasing intricacy and density regarding components, they allowed the designers in order to produce highly intricate and compact circuits and further development of blind and buried via hole technology has pressed these limits also further.

With the particular requirements of higher precision in several applications, the demands of multilayer PCB keep increasing continuously lately. The typical programs of multilayer printed circuit boards contain Computers, Data storage space, Cell phone tranny, GPS technology, satellite systems and therefore on.

A-TECH is an experienced multilayer PCB manufacturer which often own complete multilayer PCB manufacturing process in house coming from inner layer, machine lamination to surface area finishes, it gives us more benefits in the competitors of global industry shares for multilayer printed circuit boards on quality, value and lead time. Currently the proportion of multilayer PCB all of us manufactured is a lot more than 65%.

HDI PCB, the entire title is High Density Connect PCB, it needs a lot higher wiring denseness with finer trace and spacing, more compact vias and larger connection pad density. Blind and buried vias? design is one of their marked feature. HDI PCB are widely applied for Mobile phone, capsule computer, digicam, GPS UNIT, LCD module and other different location.

A-TECH CIRCUITS gives HDI PCB production services to worldwide customers in the high end automotive market, medical electronic device industry, mobile, computing in addition to defense industry.

multilayer pcb At present the advanced HDI technology we used include: “Direct Laser beam Drill”(DLD) is drilling of copper level by direct CO2 laser irradiation, compare to additional laser going with conformal cover up, the copper immediate laser drilling is capable of providing higher accuracy, better gap quality and better efficiency for HDI projects. “Copper Filled” for special stack microvia, “Laser Immediate Imaging”(LDI) is particularly designed for good line technology, in order to eliminate dimensional stability problem of art work caused by environmental and material concerns.